Various memory Circuits

Assembly/installation: surface-mounted component (SMD)

Conditioning: plastic tube. Conditioning unit: 11. Note: Low-Power CMOS. Note: With Backup Battery. Number of terminals: 32. RoHS: yes. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-32. Operating temperature: 0...+70°C. VCC: 4.5...5.5V. Supply voltage: 6V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO8. Configuration: surface-mounted component (SMD). Number of terminals: 8. Memory type: SRAM +RTC. Memory circuit family: DS13. Memory size [byte]: 64 Byte. Memory configuration: 64x8-bit. Max clock signal (MHz): 100kHz. Interface type: serial interface, I2C bus. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP16. Configuration: PCB through-hole mounting. Number of terminals: 16. Memory type: SRAM memory, serial bus access. Memory circuit family: DS24. Memory size [byte]: 4 Kbit. Memory configuration: 16x256-bit. Max clock signal (MHz): 15.2kbit/s - 2Mbit/s. Interface type: serial interface, '1-Wire / 3-wire'. Minimum supply voltage (V): +2.8V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO16W. Configuration: surface-mounted component (SMD). Number of terminals: 16. Memory type: SRAM memory, serial bus access. Memory circuit family: DS24. Memory size [byte]: 4 Kbit. Memory configuration: 16x256-bit. Max clock signal (MHz): 15.2kbit/s - 2Mbit/s. Interface type: serial interface, '1-Wire / 3-wire'. Minimum supply voltage (V): +2.8V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C

Number of terminals: 8. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-8

Note: SAMSUNG TXT. Note: CMOS S-RAM. Housing: DIP

Function: Memory. Number of terminals: 8. Memory type: NOR Flash. Program storage memory: 1Mbit. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Series: 'FLASH' memory. Power supply: 2.7...3.6V. Housing: SO. Housing (according to data sheet): SOP8. Operating frequency: 80MHz. Operating temperature: -40...85°C. Inputs/outputs: Dual I/O, SPI

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: PLCC32. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory type: FIFO. Memory circuit family: 72. Memory size [byte]: 512x9-bit. Memory configuration: 512x9-bit. Max clock signal (MHz): 35 ns. Interface type: Parallel. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: PLCC32. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory type: Dualport RAM. Memory circuit family: 72. Memory size [byte]: 32K x 9-bit. Memory configuration: 32K x 9-bit. Max clock signal (MHz): 25 ns. Interface type: Parallel. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C

Marking on the case: IS62C256AL. Number of terminals: 28. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-28. Operating temperature: -40...+85°C. VCC: 4.5...5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO16. Configuration: surface-mounted component (SMD). Number of terminals: 16. Memory type: Audio recording analog memory. Memory circuit family: ISD. Memory size [byte]: 32 sec. Memory configuration: 1 x 32s. Max clock signal (MHz): 12kHz. Interface type: I/O-pin. Minimum supply voltage (V): +2.4V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO16. Configuration: surface-mounted component (SMD). Number of terminals: 16. Memory type: Audio recording analog memory. Memory circuit family: ISD. Memory size [byte]: 40 sec. Memory configuration: 1 x 40s. Max clock signal (MHz): 12kHz. Interface type: I/O-pin. Minimum supply voltage (V): +2.4V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Housing (JEDEC standard): SO

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP28. Configuration: PCB through-hole mounting. Number of terminals: 28. Memory type: Audio recording analog memory. Memory circuit family: ISD. Memory size [byte]: 60 sec. Memory configuration: 1 x 60s. Max clock signal (MHz): 12kHz. Interface type: SPI serial bus. Minimum supply voltage (V): +2.4V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C

Note: commercial temperature range. Assembly/installation: surface-mounted component (SMD). Housing: TSOP. Housing (according to data sheet): TSOP-1

Note: industrial temperature range. Assembly/installation: surface-mounted component (SMD). Housing: TSOP. Housing (according to data sheet): TSOP-1

Note: commercial temperature range. Assembly/installation: surface-mounted component (SMD). Housing: TSOP. Housing (according to data sheet): TSOP-1

Note: commercial temperature range. Assembly/installation: surface-mounted component (SMD). Housing: TSOP. Housing (according to data sheet): TSOP-2

Note: SRAM. Number of terminals: 28. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-28

Memory type: EEPROM memory size. Memory Size: 2kb. Interface: I2C. Access time: 900ns. Voltage supply: 2.5-5.5V. Operating temperature: -40...+85°C. Mounting Type: SMD. Housing: SO8

Note: CMOS OTP. Number of terminals: 32. Assembly/installation: surface-mounted component (SMD). Housing: PLCC. Housing (according to data sheet): PLCC-32

Function: OTP-EPROM. Note: 256 Kbit (32Kb × 8). Number of terminals: 32. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: PLCC. Housing (according to data sheet): PLCC-32. Operating temperature: 0...+70°C. VCC: 5V

RoHS: yes. Max clock signal (MHz): 100 ns. Interface type: Parallel. Minimum supply voltage (V): +4.75V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Conditioning: plastic tube. Conditioning unit: 12. Note: 64kbit TIMEKEEPER SRAM 5V 10%. Note: battery/quartz. Note: 64Kbit (8Kx8). Number of terminals: 28. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-28. VCC: 4.75...5.5V

Conditioning: plastic tube. Conditioning unit: 12. Production date: 2015/03. Note: 64kbit TIMEKEEPER SRAM 5V 10%. Note: battery/quartz. Note: 64Kbit (8Kx8). Number of terminals: 28. RoHS: yes. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-28. VCC: 4.5...5.5V

RoHS: yes. Memory circuit family: M48Z. Memory size [byte]: 2 KByte. Memory configuration: 2K x 8-bit. Max clock signal (MHz): 70 ns. Interface type: Parallel. Minimum supply voltage (V): +4.75V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Function: yes. Number of terminals: 24. RAM memory: SRAM 16Kbit (2Kx8). Assembly/installation: PCB through-hole mounting. Housing: DIP. Operating temperature: 0...+70°C. VCC: 4.75...5.5V