Various memory Circuits

Housing: PCB soldering (SMD). Housing: SO16. Configuration: surface-mounted component (SMD). RoHS: yes. Component family: Memory integrated circuit. Number of terminals: 16. Memory type: Audio recording analog memory. Memory circuit family: ISD. Memory size [byte]: 40 sec. Memory configuration: 1 x 40s. Interface type: I/O-pin. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 12kHz. Minimum supply voltage (V): +2.4V. Maximum supply voltage (V): +5.5V. Housing (JEDEC standard): SO

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP28. Configuration: PCB through-hole mounting. Number of terminals: 28. Memory type: Audio recording analog memory. Memory circuit family: ISD. Memory size [byte]: 60 sec. Memory configuration: 1 x 60s. Interface type: SPI serial bus. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 12kHz. Minimum supply voltage (V): +2.4V. Maximum supply voltage (V): +5.5V

Assembly/installation: surface-mounted component (SMD). Housing: TSOP. Housing (according to data sheet): TSOP-1. Note: commercial temperature range

Assembly/installation: surface-mounted component (SMD). Housing: TSOP. Housing (according to data sheet): TSOP-1. Note: industrial temperature range

Assembly/installation: surface-mounted component (SMD). Housing: TSOP. Housing (according to data sheet): TSOP-1. Note: commercial temperature range

Assembly/installation: surface-mounted component (SMD). Housing: TSOP. Housing (according to data sheet): TSOP-2. Note: commercial temperature range

Note: SRAM. Number of terminals: 28. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-28

Memory type: EEPROM memory size. Memory Size: 2kb. Interface: I2C. Access time: 900ns. Voltage supply: 2.5-5.5V. Operating temperature: -40...+85°C. Mounting Type: SMD. Housing: SO8

Assembly/installation: surface-mounted component (SMD). Housing: PLCC. Housing (according to data sheet): PLCC-32. Note: CMOS OTP. Number of terminals: 32

Function: OTP-EPROM. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: PLCC. Housing (according to data sheet): PLCC-32. Operating temperature: 0...+70°C. VCC: 5V. Note: 256 Kbit (32Kb × 8). Number of terminals: 32

Conditioning: plastic tube. Conditioning unit: 12. Note: 64kbit TIMEKEEPER SRAM 5V 10%. Note: battery/quartz. Note: 64Kbit (8Kx8). Number of terminals: 28. RoHS: yes. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-28. VCC: 4.75...5.5V. Max clock signal (MHz): 100 ns. Interface type: Parallel. Minimum supply voltage (V): +4.75V. Maximum supply voltage (V): +5.5V. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C

Conditioning: plastic tube. Conditioning unit: 12. Production date: 2015/03. Note: 64kbit TIMEKEEPER SRAM 5V 10%. Note: battery/quartz. Note: 64Kbit (8Kx8). Number of terminals: 28. RoHS: yes. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-28. VCC: 4.5...5.5V

RoHS: yes. Memory circuit family: M48Z. Memory size [byte]: 2 KByte. Memory configuration: 2K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 70 ns. Minimum supply voltage (V): +4.75V. Maximum supply voltage (V): +5.5V. Function: yes. Number of terminals: 24. RAM memory: SRAM 16Kbit (2Kx8). Assembly/installation: PCB through-hole mounting. Housing: DIP. Operating temperature: 0...+70°C. VCC: 4.75...5.5V

RoHS: yes. Memory size [byte]: 8 KByte. Memory configuration: 8K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 100 ns. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V. Conditioning: plastic tube. Conditioning unit: 12. Note: PCB soldering. Note: 64Kbit (8Kx8). Number of terminals: 28. Assembly/installation: PCB through-hole mounting. Housing: DIP. VCC: 4.5-5.5V

Note: Vcc 4.5V...5.5V. Note: 64Kbit (8Kx8). Housing (according to data sheet): PC DIP-28

Assembly/installation: PCB through-hole mounting

Number of terminals: 8. Assembly/installation: surface-mounted component (SMD). Series: 93C76. Housing: SO. Housing (according to data sheet): SO-8. Operating frequency: 2 MHz. Operating temperature: -40...+85°C. Supply voltage: 2.5...5.5V. Spec info: SPI interface

Conditioning: plastic tube. Conditioning unit: 100dB. Wavelength (dominant): EEPROM Memory IC. Equivalents: M95320-WMN6TP. Number of terminals: 8. RoHS: yes. Spec info: 32-Kbit serial SPI bus EEPROM with high-speed clock. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SO-8. Operating temperature: -40...+85°C. VCC: 2.5...5.5V

Note: uC-IC

Note: uC-IC

Function: +12V, 30mA-output, chargepump DC-DC converter. Number of terminals: 8. RoHS: yes. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-8. Operating temperature: 0...+70°C. Note: input voltage 4.5V...5V

Note: TV ULTRAVOX. Note: MEMORY

Number of terminals: 28. Assembly/installation: PCB through-hole mounting. Housing: DIP. Housing (according to data sheet): DIP-28 ( 300mil )

Function: FLASH memory with serial access. CMOS. Number of terminals: 8. Dimensions: 4.9x3.9mm. Clock signal: 86 MHz. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SOP8L (150mil). Operating temperature: -40...+85°C. VCC: 2.7...3.6V

Function: FLASH memory with serial access. CMOS. Number of terminals: 8. Dimensions: 5.23x5.28mm. Clock signal: 86 MHz. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SO. Housing (according to data sheet): SOP8L (200mil). Operating temperature: -40...+85°C. VCC: 2.7...3.6V