Standard and Rectifier Diodes

Forward current (AV): 1A. IFSM: 30A. Housing: DO-214. Housing (according to data sheet): SMA DO214AC. VRRM: 600V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 250 ns. Semiconductor material: silicon. Function: silicon fast rectifier diode. Number of terminals: 2. RoHS: yes. Spec info: IFSM--30Ap t=10mS. Assembly/installation: surface-mounted component (SMD). Operating temperature: -50...+150°C. Threshold voltage Vf (max): 1.3V. Forward voltage Vf (min): 1.3V

Housing: DO-214. Housing (according to data sheet): DO-214AC ( SMA ). VRRM: 1000V. Semiconductor material: silicon. Function: silicon fast rectifier diode. Number of terminals: 2. RoHS: yes. Spec info: 30App/10ms

Forward current (AV): 2A. IFSM: 60A. Housing: DO-15. Housing (according to data sheet): DO-15 ( 3.2x7.2mm ). VRRM: 1000V. Cj: 30pF. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 500 ns. Semiconductor material: silicon. Function: FAST RECOVERY RECTIFIER. MRI (max): 100uA. MRI (min): 5uA. Number of terminals: 2. RoHS: yes. Spec info: IFSM--60Ap (t=8.3ms). Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1.2V. Forward voltage Vf (min): 1.2V

Forward current (AV): 2A. IFSM: 50A. Housing: DO-214. Housing (according to data sheet): SMB DO214AA ( 4.7x3.7x2.6 ). VRRM: 600V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 250 ns. Semiconductor material: silicon. Function: silicon fast rectifier diode. MRI (max): 200uA. MRI (min): 5uA. Number of terminals: 2. RoHS: yes. Spec info: IFSM--50Ap t=10mS. Assembly/installation: surface-mounted component (SMD). Operating temperature: -50...+150°C. Threshold voltage Vf (max): 1.3V. Forward voltage Vf (min): 1.3V

Forward current (AV): 2A. IFSM: 50A. Housing: DO-214. Housing (according to data sheet): SMB DO214AA ( 4.7x3.7x2.6 ). VRRM: 1000V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 500 ns. Semiconductor material: silicon. Function: silicon fast rectifier diode. MRI (max): 200uA. MRI (min): 5uA. Number of terminals: 2. RoHS: yes. Spec info: IFSM--50Ap t=10mS. Assembly/installation: surface-mounted component (SMD). Operating temperature: -50...+150°C. Threshold voltage Vf (max): 1.3V. Forward voltage Vf (min): 1.3V

Forward current (AV): 3A. Housing: DO-27. Housing (according to data sheet): DO-27 ( 9x5.3mm ). VRRM: 600V. Semiconductor material: silicon. Note: FAST RECOVERY RECTIFIER. Note: IFSM--200Ap/8.3mS. Number of terminals: 2. Assembly/installation: PCB through-hole mounting

Forward current (AV): 3A. IFSM: 100A. Housing: DO-214. Housing (according to data sheet): DO-214AB ( SMC ). VRRM: 200V. Trr Diode (Min.): 150 ns. Semiconductor material: silicon. Function: silicon fast rectifier diode. Note: 100App/10ms. Number of terminals: 2. Operating temperature: -50...+150°C

Forward current (AV): 3A. IFSM: 100A. Housing: DO-214. Housing (according to data sheet): DO-214AB ( SMC ). VRRM: 600V. Cj: 60pF. Trr Diode (Min.): 500 sn. Semiconductor material: silicon. Function: FAST RECOVERY RECTIFIER. Number of terminals: 2. Spec info: Ifsm 100App / 8.3ms. Assembly/installation: surface-mounted component (SMD). Operating temperature: -65...+175°C. Threshold voltage Vf (max): 1.3V. Forward voltage Vf (min): 1.3V

Forward current (AV): 3A. IFSM: 100A. Housing: DO-214. Housing (according to data sheet): SMC DO214AB. VRRM: 1000V. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 500 ns. Semiconductor material: silicon. Function: silicon fast rectifier diode. MRI (max): 200uA. MRI (min): 5uA. Number of terminals: 2. RoHS: yes. Spec info: Ifsm 100Ap (t=10ms). Assembly/installation: surface-mounted component (SMD). Operating temperature: -50...+150°C. Threshold voltage Vf (max): 1.3V. Forward voltage Vf (min): 1.3V

Forward current (AV): 6A. IFSM: 200A. Housing: DO-201. Housing (according to data sheet): DO-201AD ( 9.1x7.2mm ) ( R-6 ). VRRM: 1000V. Cj: 100pF. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 500 ns. Semiconductor material: silicon. MRI (max): 200uA. MRI (min): 10uA. Number of terminals: 2. RoHS: yes. Spec info: IFSM--200Ap/8.3mS. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1.2V. Forward voltage Vf (min): 1.2V

Forward current (AV): 3A. IFSM: 150A. Housing: DO-201. Housing (according to data sheet): DO-201AD ( 9.1x5.2mm ). VRRM: 600V. Cj: 40pF. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 75 ns. Semiconductor material: silicon. Function: Ultrafast Recovery Rectifier. Number of terminals: 2. Spec info: Ifms 150Ap t=8.3ms. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1.7V. Forward voltage Vf (min): 1.7V

Forward current (AV): 5A. VRRM: 400V. Semiconductor material: silicon

VRRM: 1000V. Average Rectified Current per Diode: 1A. Diode type: rectifier diode. Diode Configuration: independent. Forward Voltage (Max): <1.2V / 1A. Mounting Type: SMD. Reverse Leakage Current: 5uA / 1000V. Reverse Recovery Time (Max): 1500ns. Series: GL1

Forward current (AV): 0.25A. IFSM: 15A. Housing: DO-41. Housing (according to data sheet): DO-41 ( DO-204AL ) ( 2.7x5.2mm ). VRRM: 4000V. Cj: 3pF. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 2us. Semiconductor material: silicon. Function: 'High Voltage Glass Passivated Junction Rectifier'. Number of terminals: 2. RoHS: yes. Spec info: IFSM--15App/8.3mS. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+175°C. Threshold voltage Vf (max): 3V. Forward voltage Vf (min): 3V

Forward current (AV): 1A. IFSM: 30A. Housing: DO-41. Housing (according to data sheet): DO-41. VRRM: 200V. Cj: 25pF. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 50 ns. Semiconductor material: silicon. Function: high efficiency rectifier diode. MRI (max): 100uA. MRI (min): 5uA. Equivalents: HER103G. Number of terminals: 2. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1V. Forward voltage Vf (min): 1V

Forward current (AV): 1A. IFSM: 30A. Housing: DO-41. Housing (according to data sheet): DO-41 ( DO-204AL ). VRRM: 400V. Cj: 25pF. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 50 ns. Semiconductor material: silicon. Function: high efficiency rectifier diode. Equivalents: HER105G. Number of terminals: 2. RoHS: yes. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1.3V. Forward voltage Vf (min): 1.3V

Forward current (AV): 1A. IFSM: 30A. Housing: DO-41. Housing (according to data sheet): DO-41 ( DO-204AL ). VRRM: 1000V. Cj: 20pF. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 75 ns. Semiconductor material: silicon. Function: high efficiency rectifier diode. Equivalents: HER108G. Number of terminals: 2. RoHS: yes. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1.7V. Forward voltage Vf (min): 1.7V

Forward current (AV): 3A. IFSM: 150A peak. Housing: DO-27. Housing (according to data sheet): DO-27 (5.6 x 9.5mm). VRRM: 200V. Cj: 70pF. Trr Diode (Min.): 50 ns. Semiconductor material: silicon. Function: High Speed ​​Switching. Note: high efficiency rectifier diode. MRI (max): 150uA. MRI (min): 10uA. Number of terminals: 2. RoHS: yes. Spec info: Ifsm 150Ap T=8.3ms. Assembly/installation: PCB through-hole mounting. Operating temperature: -60...+150°C. Threshold voltage Vf (max): 1V. Forward voltage Vf (min): 1V

Forward current (AV): 3A. IFSM: 125A. Housing: DO-201. Housing (according to data sheet): DO-201AD ( 9.0x5.3mm ). VRRM: 300V. Cj: 80pF. Quantity per case: 1. Trr Diode (Min.): 50 ns. Semiconductor material: silicon. Function: High Speed ​​Switching. Note: high efficiency rectifier diode. MRI (max): 200uA. MRI (min): 10uA. Number of terminals: 2. RoHS: yes. Spec info: Ifsm 125Ap T=8.3ms. Weight: 1.1g. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1V. Forward voltage Vf (min): 1V

Forward current (AV): 3A. IFSM: 150A. Housing: DO-27. Housing (according to data sheet): DO-27 (9.5x5.6mm). VRRM: 400V. Cj: 70pF. Quantity per case: 1. Trr Diode (Min.): 75 ns. Semiconductor material: silicon. Function: High Speed ​​Switching. Note: high efficiency rectifier diode. MRI (max): 150uA. MRI (min): 10uA. Number of terminals: 2. RoHS: yes. Spec info: Ifsm 150Ap T=8.3ms. Weight: 0.4g. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1.3V. Forward voltage Vf (min): 1.3V

Forward current (AV): 3A. IFSM: 125A. Housing: DO-201. Housing (according to data sheet): DO-201AD ( 9.0x5.3mm ). VRRM: 1000V. Cj: 80pF. Quantity per case: 1. Trr Diode (Min.): 75 ns. Semiconductor material: silicon. Function: High Speed ​​Switching. Note: high efficiency rectifier diode. MRI (max): 200uA. MRI (min): 10uA. Number of terminals: 2. RoHS: yes. Spec info: Ifsm 125Ap T=8.3ms. Weight: 1.1g. Assembly/installation: PCB through-hole mounting. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1V. Forward voltage Vf (min): 1V

Forward current (AV): 6A. IFSM: 150A. Housing: R-6. Housing (according to data sheet): R-6 (8.8x7mm). VRRM: 1000V. Cj: 65pF. Semiconductor material: silicon. Function: High Speed ​​Switching. MRI (max): 200uA. MRI (min): 10uA. RoHS: yes. Spec info: 150Ap/8.3ms. Assembly/installation: PCB through-hole mounting. Tr: 75 ns. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 1.7V. Forward voltage Vf (min): 1.3V

Forward current (AV): 8A. Housing: D-PAK ( TO-252 ). Housing (according to data sheet): TO-252AA ( DPAK ) ( SOT428 ). VRRM: 600V. Semiconductor material: silicon. Note: Ultrafast. Note: Ifsm--60Aps. Pd (Power Dissipation, Max): 14W. Assembly/installation: surface-mounted component (SMD)

Forward current (AV): 8A. IFSM: 60A. Housing: TO-220. Housing (according to data sheet): TO-220AC-2. VRRM: 600V. Cj: 10pF. Conditioning: plastic tube. Conditioning unit: 50. Quantity per case: 1. Dielectric structure: Anode-Cathode. Trr Diode (Min.): 18 ns. Semiconductor material: silicon. Function: Ultrafast Soft Recovery Diode. Marking on the case: HFA08TB60. Equivalents: 39.2k Ohms. Number of terminals: 2. Pd (Power Dissipation, Max): 36W. RoHS: yes. Spec info: IFRM 24A. Assembly/installation: PCB through-hole mounting. Operating temperature: -55...+150°C. Threshold voltage Vf (max): 1.7V. Forward voltage Vf (min): 1.4V

Forward current (AV): 8A. Housing: D2PAK ( TO-263 ). Housing (according to data sheet): TO-263 ( D2PAK ). VRRM: 600V. Semiconductor material: silicon. Note: Ultrafast. Note: Ifsm 60Aps. Pd (Power Dissipation, Max): 36W. Assembly/installation: surface-mounted component (SMD)