N-channel FETs and MOSFETs

N-channel transistor, 48A, TO-247, TO-247 ( AC ), 600V. Ic(T=100°C): 48A. Housing: TO-247. Housing (according to data sheet): TO-247 ( AC ). Collector/emitter voltage Vceo: 600V. C(in): 3025pF. Cost): 245pF. CE diode: yes. Channel type: N. Conditioning: plastic tube. Conditioning unit: 25. Germanium diode: no. Collector current: 90A. Ic(pulse): 144A. Number of terminals: 3. Pd (Power Dissipation, Max): 160W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 165 ns. Td(on): 145 ns. Operating temperature: -55...+175°C. Saturation voltage VCE(sat): 1.65V. Gate/emitter voltage VGE: 30 v. Gate/emitter voltage VGE(th) min.: 4 v

N-channel transistor, 40A, TO-247, TO-247 ( AC ), 300V. Ic(T=100°C): 40A. Housing: TO-247. Housing (according to data sheet): TO-247 ( AC ). Collector/emitter voltage Vceo: 300V. C(in): 2250pF. Cost): 110pF. CE diode: no. Channel type: N. Conditioning unit: 25. Germanium diode: no. Collector current: 70A. Ic(pulse): 250A. Number of terminals: 3. Pd (Power Dissipation, Max): 160W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 112 ns. Td(on): 36ns. Operating temperature: -40...+140°C. Saturation voltage VCE(sat): 1.29V. Maximum saturation voltage VCE(sat): 2.57V. Gate/emitter voltage VGE: 30 v. Gate/emitter voltage VGE(th) min.: 2.6V. Gate/emitter voltage VGE(th)max.: 5V

N-channel transistor, PCB soldering (SMD), D²-PAK, TO-263, 40V, 130A. Housing: PCB soldering (SMD). Housing: D²-PAK. Housing (JEDEC standard): TO-263. Drain-source voltage Uds [V]: 40V. Drain Current Id [A] @ 25°C: 130A. RoHS: no. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: L1004S. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.0065 Ohms @ 78A. Gate breakdown voltage Ugs [V]: 2.7V. Switch-on time ton [nsec.]: 16 ns. Switch-off delay tf[nsec.]: 25 ns. Ciss Gate Capacitance [pF]: 5330pF. Maximum dissipation Ptot [W]: 200W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, 110A, 160A, 250uA, 0.004 Ohms, TO-220, TO-220AB, 40V. ID (T=100°C): 110A. ID (T=25°C): 160A. Idss (max): 250uA. On-resistance Rds On: 0.004 Ohms. Housing: TO-220. Housing (according to data sheet): TO-220AB. Voltage Vds(max): 40V. C(in): 6590pF. Cost): 1710pF. Channel type: N. Drain-source protection : yes. Quantity per case: 1. Trr Diode (Min.): 63 ns. Type of transistor: MOSFET. Function: High-speed switching. G-S Protection: no. Id(imp): 640A. IDss (min): 20uA. Number of terminals: 3. Pd (Power Dissipation, Max): 200W. Assembly/installation: PCB through-hole mounting. Td(off): 38 ns. Td(on): 18 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+175°C. Gate/source voltage Vgs: 20V. Vgs(th) max.: 3V. Vgs(th) min.: 1V

N-channel transistor, 140A, 200A, 200A, 0.005 Ohms, TO-220, TO-220AB, 40V. ID (T=100°C): 140A. ID (T=25°C): 200A. Idss (max): 200A. On-resistance Rds On: 0.005 Ohms. Housing: TO-220. Housing (according to data sheet): TO-220AB. Voltage Vds(max): 40V. Channel type: N. Quantity per case: 1. Type of transistor: MOSFET. Id(imp): 790A. Pd (Power Dissipation, Max): 230W. Assembly/installation: PCB through-hole mounting. Technology: HEXFET Power MOSFET. Function: Fast Switching, Logic-Level Gate Drive

N-channel transistor, PCB soldering, TO-220AB, 40V, 140A. Housing: PCB soldering. Housing: TO-220AB. Drain-source voltage Uds [V]: 40V. Drain Current Id [A] @ 25°C: 140A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRL1404ZPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.003 Ohms @ 75A. Gate breakdown voltage Ugs [V]: 2.7V. Switch-on time ton [nsec.]: 19 ns. Switch-off delay tf[nsec.]: 30 ns. Ciss Gate Capacitance [pF]: 5080pF. Maximum dissipation Ptot [W]: 230W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, 140A, 200A, 20uA, 200A, 2.5M Ohms, D2PAK ( TO-263 ), TO-263 ( D2PAK ), 40V. ID (T=100°C): 140A. ID (T=25°C): 200A. Idss: 20uA. Idss (max): 200A. On-resistance Rds On: 2.5M Ohms. Housing: D2PAK ( TO-263 ). Housing (according to data sheet): TO-263 ( D2PAK ). Voltage Vds(max): 40V. C(in): 5080pF. Cost): 970pF. Channel type: N. Drain-source protection : diode. Quantity per case: 1. Trr Diode (Min.): 26 ns. Type of transistor: MOSFET. Function: High-speed switching. G-S Protection: no. Id(imp): 790A. Pd (Power Dissipation, Max): 230W. Assembly/installation: surface-mounted component (SMD). Td(off): 30 ns. Td(on): 19 ns. Technology: HEXFET Power MOSFET

N-channel transistor, 60A, 116A, 250uA, 0.07 Ohms, TO-220, TO-220AB, 30 v. ID (T=100°C): 60A. ID (T=25°C): 116A. Idss (max): 250uA. On-resistance Rds On: 0.07 Ohms. Housing: TO-220. Housing (according to data sheet): TO-220AB. Voltage Vds(max): 30 v. C(in): 3290pF. Cost): 1270pF. Channel type: N. Drain-source protection : Zener diode. Quantity per case: 1. Trr Diode (Min.): 56 ns. Type of transistor: MOSFET. Function: Fast Switching, Dynamic dv/dt Rating. G-S Protection: no. Id(imp): 400A. IDss (min): 25uA. Number of terminals: 3. Pd (Power Dissipation, Max): 180W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 23 ns. Td(on): 11 ns. Technology: HEXFET® Power MOSFET. Operating temperature: -55...+175°C. Gate/source voltage Vgs: 16V. Vgs(th) min.: 1V

N-channel transistor, PCB soldering, TO-220AB, 30 v, 100A. Housing: PCB soldering. Housing: TO-220AB. Drain-source voltage Uds [V]: 30 v. Drain Current Id [A] @ 25°C: 100A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRL2203NPBF. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.007 Ohms @ 60A. Gate breakdown voltage Ugs [V]: 2.7V. Switch-on time ton [nsec.]: 11 ns. Switch-off delay tf[nsec.]: 23 ns. Ciss Gate Capacitance [pF]: 3290pF. Maximum dissipation Ptot [W]: 130W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, PCB soldering (SMD), D²-PAK, TO-263, 30 v, 75A. Housing: PCB soldering (SMD). Housing: D²-PAK. Housing (JEDEC standard): TO-263. Drain-source voltage Uds [V]: 30 v. Drain Current Id [A] @ 25°C: 75A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: L2203NS. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.007 Ohms @ 60A. Gate breakdown voltage Ugs [V]: 3V. Switch-on time ton [nsec.]: 11 ns. Switch-off delay tf[nsec.]: 23 ns. Ciss Gate Capacitance [pF]: 3290pF. Maximum dissipation Ptot [W]: 180W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, PCB soldering (SMD), D²-PAK, TO-263, 30 v, 75A. Housing: PCB soldering (SMD). Housing: D²-PAK. Housing (JEDEC standard): TO-263. Drain-source voltage Uds [V]: 30 v. Drain Current Id [A] @ 25°C: 75A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: L2203NS. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.007 Ohms @ 60A. Gate breakdown voltage Ugs [V]: 3V. Switch-on time ton [nsec.]: 11 ns. Switch-off delay tf[nsec.]: 23 ns. Ciss Gate Capacitance [pF]: 3290pF. Maximum dissipation Ptot [W]: 180W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, 74A, 104A, 104A, 0.008 Ohms, TO-220, TO-220AB, 55V. ID (T=100°C): 74A. ID (T=25°C): 104A. Idss (max): 104A. On-resistance Rds On: 0.008 Ohms. Housing: TO-220. Housing (according to data sheet): TO-220AB. Voltage Vds(max): 55V. Channel type: N. Quantity per case: 1. Type of transistor: MOSFET. Function: Logic-Level. Id(imp): 360A. Pd (Power Dissipation, Max): 200W. Assembly/installation: PCB through-hole mounting. Technology: HEXFET Power MOSFET

N-channel transistor, PCB soldering (SMD), D²-PAK, TO-263, 55V, 104A. Housing: PCB soldering (SMD). Housing: D²-PAK. Housing (JEDEC standard): TO-263. Drain-source voltage Uds [V]: 55V. Drain Current Id [A] @ 25°C: 104A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: L2505S. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.008 Ohms @ 54A. Gate breakdown voltage Ugs [V]: 2V. Switch-on time ton [nsec.]: 12 ns. Switch-off delay tf[nsec.]: 43 ns. Ciss Gate Capacitance [pF]: 5000pF. Maximum dissipation Ptot [W]: 200W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, 39A, 55A, 250uA, 0.026 Ohms, TO-220, TO-220AB, 100V. ID (T=100°C): 39A. ID (T=25°C): 55A. Idss (max): 250uA. On-resistance Rds On: 0.026 Ohms. Housing: TO-220. Housing (according to data sheet): TO-220AB. Voltage Vds(max): 100V. C(in): 3700pF. Cost): 630pF. Channel type: N. Quantity per case: 1. Type of transistor: MOSFET. Function: Logic-Level. Id(imp): 190A. IDss (min): 10uA. Pd (Power Dissipation, Max): 200W. Assembly/installation: PCB through-hole mounting. Td(off): 49 ns. Td(on): 11 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+175°C. Gate/source voltage Vgs: 16V. Vgs(th) max.: 2V. Vgs(th) min.: 1V

N-channel transistor, PCB soldering, TO-220AB, 20V, 110A. Housing: PCB soldering. Housing: TO-220AB. Drain-source voltage Uds [V]: 20V. Drain Current Id [A] @ 25°C: 110A. RoHS: no. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRL3502. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.007 Ohms @ 64A. Gate breakdown voltage Ugs [V]: 2V. Switch-on time ton [nsec.]: 10 ns. Switch-off delay tf[nsec.]: 96 ns. Ciss Gate Capacitance [pF]: 4700pF. Maximum dissipation Ptot [W]: 140W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, PCB soldering (SMD), D²-PAK, TO-263, 20V, 110A. Housing: PCB soldering (SMD). Housing: D²-PAK. Housing (JEDEC standard): TO-263. Drain-source voltage Uds [V]: 20V. Drain Current Id [A] @ 25°C: 110A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: L3502S. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.007 Ohms @ 64A. Gate breakdown voltage Ugs [V]: 2V. Switch-on time ton [nsec.]: 10 ns. Switch-off delay tf[nsec.]: 96 ns. Ciss Gate Capacitance [pF]: 4700pF. Maximum dissipation Ptot [W]: 140W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

N-channel transistor, 63A, 89A, 250uA, 0.01 Ohms, TO-220, TO-220AB, 55V. ID (T=100°C): 63A. ID (T=25°C): 89A. Idss (max): 250uA. On-resistance Rds On: 0.01 Ohms. Housing: TO-220. Housing (according to data sheet): TO-220AB. Voltage Vds(max): 55V. C(in): 3600pF. Cost): 870pF. Channel type: N. Conditioning: plastic tube. Conditioning unit: 50. Quantity per case: 1. Trr Diode (Min.): 94us. Type of transistor: MOSFET. Id(imp): 310A. IDss (min): 25uA. Number of terminals: 3. Pd (Power Dissipation, Max): 170W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 37 ns. Td(on): 12 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+175°C. Gate/emitter voltage VGE(th)max.: 2V. Gate/source voltage Vgs: 16V. Vgs(th) min.: 1V. Function: Logic-Level Gate Drive, Fast Switching. Drain-source protection : yes. G-S Protection: no

N-channel transistor, PCB soldering, TO-220AB, 55V, 89A. Housing: PCB soldering. Housing: TO-220AB. Drain-source voltage Uds [V]: 55V. Drain Current Id [A] @ 25°C: 89A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRL3705N. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.01 Ohms @ 46A. Gate breakdown voltage Ugs [V]: 2V. Switch-on time ton [nsec.]: 12 ns. Switch-off delay tf[nsec.]: 37 ns. Ciss Gate Capacitance [pF]: 3600pF. Maximum dissipation Ptot [W]: 170W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, 180A, 260A, 100uA, 0.003 Ohms, TO-220, TO-220AB, 30 v. ID (T=100°C): 180A. ID (T=25°C): 260A. Idss (max): 100uA. On-resistance Rds On: 0.003 Ohms. Housing: TO-220. Housing (according to data sheet): TO-220AB. Voltage Vds(max): 30 v. C(in): 5890pF. Cost): 3130pF. Channel type: N. Drain-source protection : Zener diode. Quantity per case: 1. Trr Diode (Min.): 75 ns. Type of transistor: MOSFET. Function: very Low Rds. G-S Protection: no. Id(imp): 1040A. IDss (min): 20uA. Number of terminals: 3. Pd (Power Dissipation, Max): 330W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 40 ns. Td(on): 16 ns. Technology: SMPS MOSFET. Operating temperature: -55...+175°C. Gate/source voltage Vgs: 20V. Vgs(th) max.: 2.5V. Vgs(th) min.: 1V

N-channel transistor, 170A, 200A, 200A, 0.003 Ohms, 30 v. ID (T=100°C): 170A. ID (T=25°C): 200A. Idss (max): 200A. On-resistance Rds On: 0.003 Ohms. Voltage Vds(max): 30 v. Channel type: N. Quantity per case: 1. Type of transistor: MOSFET. Function: Very low Rds-on on-resistance. Note: UltraLow Gate. Pd (Power Dissipation, Max): 200W. Technology: SMPS MOSFET

N-channel transistor, PCB soldering (SMD), D²-PAK, TO-263, 30 v, 260A. Housing: PCB soldering (SMD). Housing: D²-PAK. Housing (JEDEC standard): TO-263. Drain-source voltage Uds [V]: 30 v. Drain Current Id [A] @ 25°C: 260A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: L3713S. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.004 Ohms @ 30A. Gate breakdown voltage Ugs [V]: 2.5V. Switch-on time ton [nsec.]: 16 ns. Switch-off delay tf[nsec.]: 40 ns. Ciss Gate Capacitance [pF]: 5890pF. Maximum dissipation Ptot [W]: 170W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C

N-channel transistor, 98A, 140A, 250uA, 0.006 Ohms, TO-220, TO-220AB, 30 v. ID (T=100°C): 98A. ID (T=25°C): 140A. Idss (max): 250uA. On-resistance Rds On: 0.006 Ohms. Housing: TO-220. Housing (according to data sheet): TO-220AB. Voltage Vds(max): 30 v. C(in): 5000pF. Cost): 1800pF. Channel type: N. Drain-source protection : Zener diode. Quantity per case: 1. Trr Diode (Min.): 120ns. Type of transistor: MOSFET. Function: Logic-Level. G-S Protection: no. Id(imp): 470A. IDss (min): 25uA. Number of terminals: 3. Pd (Power Dissipation, Max): 200W. RoHS: yes. Assembly/installation: PCB through-hole mounting. Td(off): 29 ns. Td(on): 14 ns. Technology: HEXFET Power MOSFET. Operating temperature: -55...+175°C. Gate/source voltage Vgs: 16V. Vgs(th) min.: 1V

N-channel transistor, TO-220AB, 30 v, 140A, PCB soldering. Housing: TO-220AB. Drain-source voltage Uds [V]: 30 v. Drain Current Id [A] @ 25°C: 140A. Housing: PCB soldering. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.006 Ohms @ 71A. Gate breakdown voltage Ugs [V]: 2V. Switch-on time ton [nsec.]: 14 ns. Switch-off delay tf[nsec.]: 29 ns. Ciss Gate Capacitance [pF]: 5000pF. Maximum dissipation Ptot [W]: 200W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: PCB through-hole mounting. Number of terminals: 3. Manufacturer's marking: IRL3803

N-channel transistor, 83A, 60.4k Ohms, 250uA, 0.006 Ohms, D2PAK ( TO-263 ), D2PAK ( TO-263 ), 30 v. ID (T=100°C): 83A. ID (T=25°C): 60.4k Ohms. Idss (max): 250uA. On-resistance Rds On: 0.006 Ohms. Housing: D2PAK ( TO-263 ). Housing (according to data sheet): D2PAK ( TO-263 ). Voltage Vds(max): 30 v. C(in): 5000pF. Cost): 1800pF. Channel type: N. Drain-source protection : Zener diode. Quantity per case: 1. Trr Diode (Min.): 120ns. Type of transistor: MOSFET. Function: Gate control by logic level. G-S Protection: no. Id(imp): 470A. IDss (min): 25uA. Number of terminals: 2. Pd (Power Dissipation, Max): 150W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Td(off): 29 ns. Td(on): 14 ns. Technology: HEXFET® Power MOSFET. Operating temperature: -55...+175°C. Gate/source voltage Vgs: 16V. Vgs(th) max.: 1V. Vgs(th) min.: 1V

N-channel transistor, PCB soldering (SMD), D²-PAK, TO-263, 30 v, 140A. Housing: PCB soldering (SMD). Housing: D²-PAK. Housing (JEDEC standard): TO-263. Drain-source voltage Uds [V]: 30 v. Drain Current Id [A] @ 25°C: 140A. RoHS: yes. Component family: MOSFET, N-MOS. Configuration: surface-mounted component (SMD). Number of terminals: 3. Manufacturer's marking: L3803S. Drain current through resistor Rds [Ohm] @ Ids [A]: 0.006 Ohms @ 71A. Gate breakdown voltage Ugs [V]: 2V. Switch-on time ton [nsec.]: 14 ns. Switch-off delay tf[nsec.]: 29 ns. Ciss Gate Capacitance [pF]: 5000pF. Maximum dissipation Ptot [W]: 200W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +175°C